Online seminar: DE-NL Online Integrated Photonics Symposium 2026
course number: obb-fg-op-ips
Date
Start:
2026-06-25, 13:30
End:
2026-06-25, 16:30
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Organizer(s)
Available
places availableParticipation fees
Participation is free of charge.
Summary
The symposium will be held online in a half-day format, bringing together leading voices from the Germany and the Netherlands to strengthen collaboration in integrated photonics.
The event will focus on:
- Integrated photonics ecosystems in Germany and the Netherlands
- Advances in photonic technologies and applications
- Industry perspectives and emerging companies
- Collaboration opportunities across research, industry, and policy
The program includes sessions featuring key industry players, research leaders, and ecosystem organisations from both countries. The target audience is strategic and technical decision-makers from the industry as well as their R&D staff.
Event details
- Event: NL-DE Integrated Photonics Online Symposium
- Dates: 25 June 2026
- Format: Online, half-day sessions (~3 hours )
Scaling Photonic Integrated Circuits: From Wafers to Deployment
Scope: Silicon photonics, InP, SiN, heterogeneous integration, packaging, co-packaged
optics, LiDAR, quantum PICs
Attend Zoom meeting:
https://us06web.zoom.us/j/83797782812?pwd=AhTfRSftdPzr3zEnU90qqymPEumobE.1
Meeting-ID: 837 9778 2812, Kenncode: 757119
PIC Manufacturing, Market Deployment, Upscaling
13:30 – 13:40 | Opening: The Role of DE–NL in Europe’s PIC Manufacturing Stack, Dr. Adrian Mahlkow (OpTecBB) and Abdul Rahim (PhotonDelta)
13:40 – 14:00 | " Photonic Integration powered by the APECS pilot line", Prof. Dr. Anna Lena Schall-Giesecke (Fraunhofer IMS)
14:00 – 14:20 | “Market Data: Co-Packaged Optics & Optical I/O for AI Data Centers" , Mattis Lemaitre (YOLE Group)
14:20 – 14:40 | “A German Success Story: PIC for Computing” by Victor Brasch (Q.ANT)
14:40 – 15:00 | “More than Photonics", Dr. Tino Jäger (X-Fab)
15:00 – 15:20 | Break
15:20 – 15:40 | „PIC packaging enabled by glass substrates and photonic wire bonding“,
Henning Schröder (Fraunhofer IZM)
15:40 – 16:00 | “A Dutch Success Story: TFLN Photonics for Next-Gen Wireless Communications”, Franken Kees (Sabratha)
16:00 – 16:20 | "Photonic Design Kits (PDKs) & Tape-Out Workflows for PIC Startups", Dzmitry Pustakhod (JePPIX)
16:20 – 16:40 | Global PIC Manufacturing Footprint: EU, US, and Asia, Abdul Rahim (PhotonDelta) and Wrap-up
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OpTecBB is inviting you to a planned Zoom meeting:
https://us06web.zoom.us/j/83797782812?pwd=AhTfRSftdPzr3zEnU90qqymPEumobE.1
Meeting-ID: 837 9778 2812
Kenncode: 757119
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Schnelleinwahl mobil
+13017158592,,83797782812#,,,,*757119# Vereinigte Staaten (Washington DC)
+13052241968,,83797782812#,,,,*757119# Vereinigte Staaten
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Über SIP beitreten
• 83797782812@zoomcrc.com
Beitreten – So geht's
https://us06web.zoom.us/meetings/83797782812/invitations?signature=MEomep6Pz_TI-BHHUK6G0VQAk59Bi1jiFVIdXBM9xfU
Participation fees
Participation is free of charge.